Contract Manufacturing
IPC Standards, End to End
High-quality PCB fabrication, population, assembly, coating, rework, inspection, and testing — from prototype through full-scale production. All in-house. No subcontracting the hard parts to an outside board house and hoping tolerances match.
Every UTI technology product runs through this same manufacturing line. The inspection processes that validate UTI’s defense and aerospace hardware are the same processes that validate yours.
PCB Fabrication
Multi-layer board routing and plating. Prototype and production runs produced on the same equipment — no separate prototype shop with lower process standards or different material sets. What passes prototype inspection is what goes into production.
Assembly & Population
Full-automatic stencil printing with vision systems. Robotic solder paste dispensing. High-speed pick-and-place. Full-profile reflow ovens. Assembly capability from the smallest passive components through large connectors, heat-spreaders, and mixed SMT/through-hole designs.
Conformal Coating
Selective conformal coating for military, aerospace, and high-reliability industrial applications. Compliant to IPC-CC-830, MIL-I-46058C, MIL-P-28809, NASA-STD-8739-1, and UL746C. Applied selectively where connectors and serviceable components require open areas.
Inspection & Quality Control
Automated optical inspection for post-reflow solder verification. Real-time X-ray tomography for BGA solder joint analysis and fine-pitch verification without destructive cross-section. Automated functional testing. Fault analysis and predictive failure analysis on returned or failed assemblies.
Rework & Coil Winding
SMT and BGA rework to fine-pitch component level. BGA reballing for component recovery or upgrade. Programmable coil winding with vacuum impregnation and curing for custom transformer and inductor fabrication.