Engineered Materials
Engineered materials built to perform at the edge of what physics allows, innovating with advanced diamond-like coatings, graphene heterostructures, and nanostructured approaches to thermal and electrical interface problems.
SX Thermal™
Heat transfer that never fails under pressure
Conductive and non-conductive thermal material family. Hybrid phase-change thermal interface compounds achieving 40+ W/m·K thermal conductivity. Pump-out resistant, non-evaporative, and chemically inert. Custom formulations span aerospace cryogenic environments to SiC power semiconductor junctions. Dispensable and screen-printable with ultra-low bond line thickness. Halogen-free, RoHS and REACH compliant.
C2 Barrier™
Atomic-scale electrical isolation with zero thermal penalty
Graphene-based electrical isolation barrier exploiting hexagonal boron nitride (hBN) heterostructures. hBN's wide bandgap (~5.9 eV) and high dielectric breakdown strength provide electrical isolation at nanometer-scale thickness, while the graphene structural layer maintains mechanical integrity, gas impermeability, and exceptional in-plane thermal conductivity (~578 W/m·K). The result is an electrical isolator that blocks current without blocking heat.
Conventional electrical isolation materials force a tradeoff: insulate electrically and you insulate thermally. C2 Barrier eliminates that tradeoff. At sub-micron thickness, the graphene/hBN architecture provides dielectric isolation while simultaneously conducting heat laterally away from the junction, enabling denser power electronics packaging, thinner isolation layers in SiC/GaN devices, and new approaches to multi-chip module design where thermal and electrical paths no longer compete.